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ABOUT ZHONGSHINominated Supplier of China Aerospace and Defence companies
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PRODUCTSAll Real Products guide
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APPLICATIONProvide Customized Solutions and services
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SCIENTIFIC RESEARCHScience & Technology Progress rapidly,And New products are constantly changing
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SERVICE SUPPORTDeep Cultivation of High-end solder industry head enterprise for more than 20 years
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CONTACT USTo Provide You with professional consulting services
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EN
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Features and Benefits
· Low cost.
· High reliability: only 0.3% Ag in the alloy, but its joint strength performs better than SAC 305.
· Low voiding.
· Excellent solderability: solve the poor solder wetting problems of some important Pb-free components, eg. CSP, QFN etc.; Good solderability on various lead-free board / component finishes, including OSP, HASL, ENIG.
· Outstanding printability: long stencil life - 12 hours with continuous and consistently printing.
· Print speeds of up to 150mm/s , enabling a fast print cycle time and a high throughput.
· Wide reflow profile window: reflowable in air or nitrogen, enables high quality solderability of complicated, high density PWB assemblies.
· Excellent solder and flux cosmetics after reflow soldering.
Applications
PCB assembly, including smartphone, Tablet PC, motherboards, consumer electronics, web server, Automobile electrical system, and equipments of medical, military or aerospace etc.
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Model
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| ZSRSK01 |
| ZSRSK01-RX8 |
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Alloy
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Size
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Features&Application
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|---|---|---|
| 97Sn-0.3Ag-0.7Cu-2Bi-X | Type4（38~20） | Low Ag High Reliability, A replacement of SAC305 paste , Tiny pitch for home appliances, vehicle etc |
| 97Sn-0.3Ag-0.7Cu-2Bi-X | 97Sn-0.3Ag-0.7Cu-2Bi-X | Halogen Free |